Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out from the top, phosphor deposition and color temperature control can be significantly simplified. A package...http://www.google.fr/patents/US8115217?utm_source=gb-gplus-shareBrevet US8115217 - Systems and methods for packaging light-emitting diode devices
Systems and methods for packaging light-emitting diode devices
