Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response...http://www.google.fr/patents/US7790015?utm_source=gb-gplus-shareBrevet US7790015 - Endpoint for electroprocessing
