A leadframe includes a multiplicity of leads. The leads have a board level contact portion, an intermediate portion and a chip level contact portion. The intermediate portion is disposed between the board level contact portion and the chip level contact portion. The board level contact portions extend...http://www.google.fr/patents/US20070023871?utm_source=gb-gplus-shareBrevet US20070023871 - Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package
Semiconductor package based on lead-on-chip architecture, the fabrication ...
Numéro de demande: 11/192,981 Numéro de publication: US 2007/0023871 A1 Date de dépôt: 29 juil. 2005 Brevet délivré: US7348660 ( Date de délivrance 25 mars 2008)
