A semiconductor module (4) has a coupling substrate which is used for the internal electrical coupling of an integrated circuit on adjacent semiconductor chips (2, 3). The semiconductor chips (2, 3) have integrated circuits and are arranged on a mount structure. The semiconductor chips (2, 3) are externally...http://www.google.fr/patents/US20070080442?utm_source=gb-gplus-shareBrevet US20070080442 - Semiconductor module having a coupling substrate, and methods for its production
Semiconductor module having a coupling substrate, and methods for its production
Numéro de demande: 11/532,321 Numéro de publication: US 2007/0080442 A1 Date de dépôt: 15 sept. 2006 Brevet délivré: US7498674 ( Date de délivrance 3 mars 2009)
