A method for removing contaminants from a semiconductor wafer having a spin on coating of material. Contaminants are removed by applying a cleaning solution to the periphery, and preferably, the exposed backside of the wafer after the edge bead has been dissolved and removed. The cleaning solution is...http://www.google.fr/patents/US6255228?utm_source=gb-gplus-shareBrevet US6255228 - Method for removing contaminants from a semiconductor wafer
Method for removing contaminants from a semiconductor wafer
