A thin semiconductor device (50) can be cost effectively manufactured using conventional wire bonding technology and stamped leadframes. A flagless leadframe (12) is utilized in one embodiment. A support tape (14) having a die support surface (20) is attached transversely to a plurality of leads (18)...http://www.google.fr/patents/US5294827?utm_source=gb-gplus-shareBrevet US5294827 - Semiconductor device having thin package body and method for making the same
Semiconductor device having thin package body and method for making the same
