A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between the integrated circuit and the heat spreader, leading to a lower cost and lower mass package, as well as...http://www.google.fr/patents/US7190585?utm_source=gb-gplus-shareBrevet US7190585 - Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance
Thermal heat spreaders designed for lower cost manufacturability, lower mass ...
