[54] NON-DESTRUCTURE METHOD OF
PERFORMING ELECTRICAL BURN-IN
TESTING OF SEMICONDUCTOR CHIPS
[75] Inventors: Keith R. Pope; Gusta? Schrottke,
both of Austin, Tex.
[73] Assignee: International Business Machines Corporation, Arraonk, N.Y.
[21] Appl. No.: 510,497
[22] Filed: Apr. 18, 1990
[51] Int. CI.5 H05K3/34
[52] U.S. CI 29/840; 29/857;
228/123; 228/180.2; 361/406; 437/180
[58] Field of Search 437/180, 8; 228/180.2,
228/123; 29/857, 840; 439/876; 361/404, 405,
406
[56] References Cited
U.S. PATENT DOCUMENTS
3,141,226 7/1964 Bender et al 228/123 X
3,436,818 4/1969 Merrin et al 361/406 X
3,646,670 3/1972 Maeda et al 228/780.2 X
3,702,500 11/1972 Gorinas et al 29/857
3,716,907 2/1973 Anderson 228/180.2 X
3,811,186 5/1974 Larnerd et al 437/180 X
3,871,014 3/1975 King et al 437/180 X
4,673,772 6/1987 Satoh et al 228/180.2 X
4,887,760 12/1989 Yoshino et al 228/180.2 X
FOREIGN PATENT DOCUMENTS
1122856 5/1982 Canada 228/123
OTHER PUBLICATIONS
W. Ward, "Low-Temperature Soldered Component
Removal", IBM TDB, vol. 19, No. 7, 12/76, p. 2476.
P. Angelone, "Method for Removing Flip Chips", IBM
TDB, vol. 19, No. 7, 12/76, p. 2477.
A. Bry et al, "Reusable Chip Test Package", IBM TDB,
vol. 22, No. 4, 9/79, p. 1476.
C. Chiou et al, "Localized Heating of Chip Bonding
Pad", IBM TDB, vol. 9, No. 8, 1/67, pp. 1051-1052.
A. Formichelli et al., "Non-Destructive Torsional Chip
Removal", IBM TDB, vol. 26, No. 9, 2/84, pp.
4780-4782.
Primary Examiner—Carl E. Hall
Assistant Examiner—Carl J. Arbes
Attorney, Agent, or Firm—Andrea P. Bryant
