[li] Patent Number: 5,434,452  Date of Patent: Jul. 18, 1995
 Z-AXIS COMPLIANT MECHANICAL IC WIRING SUBSTRATE AND METHOD FOR MAKING THE SAME
 Inventor: Leo M. Higgins, HI, Austin, Tex.
 Assignee: Motorola, Inc., Schaumburg, 111.
 Appl. No.: 309,570
 Filed: Sep. 20,1994
Related U.S. Application Data
 Continuation of Ser. No. 143,775, Nov. 1, 1993, abandoned.
A compliant integrated circuit (IC) wiring substrate (10) has an insulative carrier film (14) and a plurality of micro-beam conductors (12) in the carrier film. Each of the plurality of micro-beam conductors has a pair of contact bumps (16 and 18) connected to respective posts (22 and 24). A beam element (20) connects the pair of contact bumps and posts at opposing ends and opposing surfaces of the beam element. The plurality of microbeam conductors extend through the thickness of the carrier film such that the pair of contact bumps protrude from the opposite surfaces of the carrier film. The compliance of the wiring substrate can be varied by varying locations of apertures in the insulative carrier film.
15 Claims, 4 Drawing Sheets