[54] METHOD FOR PRODUCING MULTI-BOARD ELECTRONIC DEVICE
[75] Inventors: Yasunobu Hirao, Toyokawa; Makoto Koyama, Kariya; Yuji Motoyama,
Okazaki, all of Japan
[73] Assignee: Nippondenso Co., Ltd., Kariya, Japan
[21] Appl. No.: 400,242
[22] Filed: Mar. 6,1995
Related U.S. Application Data
[62] Division of Ser. No. 118,785, Sep. 10, 1993, Pat. No. 5,408,383, which is a continuation of Ser. No. 889,701, May 29, 1992, abandoned.
[30] Foreign Application Priority Data
May 31, 1991 [JP] Japan 3-157674
[51] Int. CI.6 H05K 3/30; H01R 43/24;
H05K 3/36
[52] U.S. CL 29/841; 29/827; 29/830;
29/848
[58] Field of Search 29/827, 841, 848,
29/DIG. 29, 830; 164/112; 264/272.15;
361/388, 395, 401, 707
In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
11 Claims, 28 Drawing Sheets
