Circuitry with integrated passive components and method for producing

(54) CIRCUITRY WITH INTEGRATED PASSIVE COMPONENTS AND METHOD FOR PRODUCING

(75) Inventors: John M. Lauffer, Waverly, NY (US);

David J. Russell, Apalachin, NY (US)

(73) Assignee: International Business Machines Corporation, Armonk, NY (US)

( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl. No.: 09/353,992

(22) Filed: Jul. 15, 1999

(51) Int. CI.7 H05K 1/16; H05K 3/30

(52) U.S. CI 361/793; 361/761; 361/762;

361/763; 361/782; 361/792; 361/795; 174/260; 336/200; 428/209; 428/213; 428/215; 428/216;

29/832; 29/846; 29/854

(58) Field of Search 361/306.1, 306.2,

361/306.3, 311-313, 734, 738, 739, 780, 761-766, 792-795; 174/250, 266, 255-258, 262-264; 257/678, 691, 700-702, 723, 724; 336/200, 223, 225, 232; 338/254, 320, 309-311; 428/209, 213, 215, 216, 901; 29/25.41, 25.42, 602.1, 604, 605, 610.1, 620, 830, 831, 832, 846, 852, 854

(56) References Cited

U.S. PATENT DOCUMENTS

4,566,186 A 1/1986 Bauer et al 29/852

4,604,160 A * 8/1986 Murakami et al 29/846

4,889,790 A 12/1989 Roos et al 439/258

4,992,354 A 2/1991 Axon et al 430/258

4,999,740 A 3/1991 Ilardi et al 361/386

5,227,012 A * 7/1993 Brandli et al 428/209

5,239,448 A 8/1993 Perkins et al 361/764

5,262,280 A 11/1993 Knudsen et al 430/312

5,334,487 A 8/1994 Kindl et al 430/312

5,366,846 A 11/1994 Knudsen et al 430/280

5,371,029 A 12/1994 Abdo et al 437/51

5,485,038 A 1/1996 Licari et al 257/758

5,501,941 A 3/1996 Ngo 430/270.15

5,599,655 A 2/1997 Ngo 430/325

5,599,747 A 2/1997 Bhatt et al 437/209

(List continued on next page.)

FOREIGN PATENT DOCUMENTS

CA 2246405 6/1998 H05K/1/18

DE 2 231 614 A 1/1974

EP 0 574 206 A2 12/1993 H05K/3/46

GB 206 006 B 10/1987

GB 218 816 B 4/1999

JP 02 154496 A 6/1990 H05K/1/16

JP 05 283866 A 10/1993 H05K/3/46

WO WO 99/41019 A 8/1999 B05D/5/12

WO WO 01/06818 Al 7/2000

OTHER PUBLICATIONS

The Illustrated Dictionary ol Electronics (6th edition), by Stan Gibilisco, publ. by TAB Books, 1994: pp. 176 and 350.*

(List continued on next page.)

Primary Examiner—David L. Talbott

Assistant Examiner—-John B. Vigushin

(74) Attorney, Agent, or Firm—-James A. Lucas; Driggs,

Lucas, Brubaker & Hogg Co., LPA

(57) ABSTRACT

Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated in to electrical circuits utilizing a process which maximizes the utilization ol the planar surfaces ol the substrates for high density placement ol active components such as logic or memory integrated circuits. The passive components are integrated into a conventional circuit board utilizing a photoimageable dielectric material. The dielectric is photoimaged and etched to provide one or more recesses or openings for the passive devices, and photovias interconnecting the inputs and outputs ol the integrated circuit board. The electronic structure comprising at least one ol the passive devices integrated into a photoimaged dielectric is described as well as the method ol manulacturing the same.

24 Claims, 4 Drawing Sheets

U.S. PATENT DOCUMENTS

5,612,660 A 3/1997 Takimoto 336/200

5,623,160 A * 4/1997 Liberkowski 257/700

5,635,761 A * 6/1997 Cao et al 257/700

5,643,657 A 7/1997 Dueber et al 428/209

5,648,200 A 7/1997 Ledze et al 430/315

5,665,650 A 9/1997 Lauffer et al 216/20

5,691,395 A 11/1997 Knudsen et al 522/31

5,700,607 A 12/1997 Rath et al 430/15

5,707,782 A 1/1998 Economy et al 430/285.1

5,709,979 A 1/1998 Casson et al 430/311

5,721,088 A 2/1998 Martin et al 430/270.1

5,724,232 A 3/1998 Bhatt et al 361/762

5^796,587 A * 8/1998 Lauffer et al 361/763

6,008,102 A * 12/1999 Alford et al 336/200

6,147,876 A * 11/2000 Yamaguchi et al 361/766

6,169,320 Bl * 1/2001 Stacey 336/200

6,194,990 Bl * 2/2001 Lee et al 338/320

6,225,570 Bl * 5/2001 Ishiyama et al 361/762

6,229,098 Bl * 5/2001 Dunn et al 174/255

OTHER PUBLICATIONS

International Search Report dated Oct. 16, 2000 re Application No. PCT/GB 00/02679, filed Jul. 13, 2000. IBM Technical Disclosure Bulletin vol. 36, No. 10. Oct. 1993, "Polymer Resistor Formation in Photo Via", p. 349. "Surface Laminar Circuit Packaging", by Y. Tsukada et al, Proceedings of the 42nd Electronics Components & Technology Conference, May, 1992, pp. 22-27'. "Multichip Modules", ICEMM Proceedings '93, Apr. 14-16, 1993, vol. 1986, pp. 435^40. Hungarian Search Report re Application P 0202178. International Search Report re Application PCT/GB 00/ 02679.

* cited by examiner