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US007094673B2

(12) United States Patent

Agarwal

(io) Patent No.: (45) Date of Patent:

US 7,094,673 B2 *Aug. 22, 2006

(54) ETCH STOP LAYER IN POLY-METAL STRUCTURES

(75) Inventor: Vishnu K. Agarwal, Boise, ID (US)

(73) Assignee: Micron Technology, Inc., Boise, ID (US)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

This patent is subject to a terminal disclaimer.

(21) Appl. No.: 10/894,292

(22) Filed: Jul. 19, 2004

(65) Prior Publication Data

US 2004/0259338 Al Dec. 23, 2004

Related U.S. Application Data

(62) Division of application No. 10/438,360, filed on May 14, 2003, now Pat. No. 6,875,679.

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