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United States Patent m

Lindeman

[ii] Patent Number: [45] Date of Patent:

5,672,062 Sep. 30, 1997

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High-Density Printed Circuit Connector, Callaway et al., IBM Tech. Disci, bull. vol. 8, No. 3, Aug. 1965, pp. 351-352.

Teradyne Technical bulletin 237, p. 8 with 339-17. LC and Jan. 29, 1985 noted on it.

"Shielded In-line Electrical Multiconnector", Straus, IBM Technical Disclosure Bulletin, vol. 10, No. 3, Aug., 1967, p. 703.

EPO Search Report Mailed 01 Sep. 1995.

Application Ser. No. 07/738,051 filed Jul. 31,1991 by or on

behalf of Robert P. Stimson.

Primary Examiner—-David L. Pirlot
Assistant Examiner—Daniel Wittels
Attorney, Agent, or Firm—Leydig, Voit & Mayer, Ltd.

[57] ABSTRACT

Connectors are provided for propagation of electrical signals in a plurality of closely spaced propagation paths, such as between circuits connected to conductive pads of circuit boards, each circuit presenting a certain characteristic impedance at a pad connected thereto. For example, each connector includes a plurality of resilient and electrically conductive signal-propagating interconnect means having opposite ends engageable with conductive pads on a pair of the circuit boards. The interconnect means are supported by insulating means of a support structure which also provides conductive ground means in adjacent relation to the conductive interconnect means. The conductive ground means are arranged for connection to grounding elements of the circuit boards. The configuration and characteristics of the ground conductor means and the insulating means in relation to each signal-propagating interconnect means are such as to obtain a certain characteristic impedance for matching the characteristic impedances of circuits interconnected by each signal-propagating interconnect means.

10 Claims, 5 Drawing Sheets

Page 2

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