IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIM
US006423623B1
(12) United States Patent ao) Patent No.: us 6,423,623 Bi
Bencuya et al. (45) Date of Patent: *Jul. 23,2002
(54) LOW RESISTANCE PACKAGE FOR SEMICONDUCTOR DEVICES
(75) Inventors: Izak Bencuya, Saratoga, CA (US);
Maria Christina B. Estacio, Bacayan
(PH); Steven P. Sapp, Felton, CA (US);
Consuelo N. Tangpuz; Gilmore S.
Baje, both of Lapulapu (PH); Rey D.
Maligro, Cordova (PH)
(73) Assignee: Fairchild Semiconductor Corporation,
Portland, ME (US)
( * ) Notice: This patent issued on a continued prosecution application filed under 37 CFR 1.53(d), and is subject to the twenty year patent term provisions of 35 U.S.C. 154(a)(2).
Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
5,075,965 A 12/1991 Carey et al 29/840
5,143.865 A * 9/1992 Hideshima et al 437/183
5,311,402 A 5/1994 Kobayashi et al 361/760
5,313,366 A 5/1994 Gaudenzi et al 361/760
5,367,435 A 11/1994 Andros et al 361/749
5,381,039 A 1/1995 Morrison 257/701
5,394,490 A 2/1995 Kato et al 385/14
5,397.921 A 3/1995 Karnezos 257/779
5,424,581 A * 6/1995 Bourg et al 257/786
5,447,886 A 9/1995 Rai 437/183
5,448,114 A 9/1995 Kondoh et al 257/778
5,454,160 A 10/1995 Nickel 29/840
5,477.087 A 12/1995 Kawakita et al 257/737
5,510,758 A 4/1996 Fujita et al 333/247
5,512,786 A 4/1996 Imamura et al 257/780
5,532,512 A 7/1996 Fillion et al 257/686
5,654,590 A 8/1997 Kuramochi 257/778
5,703.405 A 12/1997 Zeber 257/777
5.726.501 A 3/1998 Matsubara 257/778
5.726.502 A 3/1998 Beddingfield 257/797
5,729,440 A 3/1998 Jimarez et al 361/779
5,734,201 A 3/1998 Djennas et al 257/783
5,739.585 A 4/1998 Akram et al 257/698
6,249,041 Bl * 6/2001 Kasem et al 257/666
