(54) LEADFRAME AND PACKAGED LIGHT EMITTING DIODE
(75) Inventors: Do Hyung Kim, Suwon-si (KR);
Chung Hoon Lee, Gwangmyeong-si
(KR); Keon Young Lee, Ansan-si (KR)
(73) Assignee: Seoul Semiconductor Co., Ltd., Seoul (KR)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 11/178,144
(22) Filed: Jul. 8, 2005
(65) Prior Publication Data
US 2006/0133044 Al Jun. 22, 2006
(30) Foreign Application Priority Data
Dec. 16, 2004 (KR) 10-2004-0106936
Dec. 28, 2004 (KR) 10-2004-0113722
Jan. 3, 2005 (KR) 10-2005-0000269
(51) Int. CI.
H01L 33/00 (2006.01)
(52) U.S. CI 257/99; 257/98; 257/100;
257/675; 257/E33.058; 257/E33.075
(58) Field of Classification Search 257/99,
257/100, 675, 676, E33.056, E33.066, E33.075, 257/81,707, 98, E33.058 See application file for complete search history.
A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.
19 Claims, 11 Drawing Sheets
