Thermally and electrically conductive interconnect structures

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US007760507B2

(12) United States Patent ao) Patent No.: Us 7,760,507 B2

Jewrametal. (45) Date of Patent: Jul. 20,2010

An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 p si.

20 Claims, 2 Drawing Sheets

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