Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support...http://www.google.fr/patents/US7459795?utm_source=gb-gplus-shareBrevet US7459795 - Method to build a wirebond probe card in a many at a time fashion
Method to build a wirebond probe card in a many at a time fashion
