A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating...http://www.google.fr/patents/US7432604?utm_source=gb-gplus-shareBrevet US7432604 - Semiconductor component and system having thinned, encapsulated dice
Semiconductor component and system having thinned, encapsulated dice
