About 193 results
|Lower surface terminals (41, 42, 43) are provided on the lower surface of a |
magnetic substrate (30); an upper surface electrode is formed on ...
|An X-ray imaging apparatus acquiring a differential phase contrast image of a |
test object without using a light-shielding mask for X-ray.
|The invention provides a package type semiconductor device and a |
manufacturing method thereof where reliability is improved without ...
|The invention provides a CSP type semiconductor device with high reliability. |
The semiconductor device includes a pad electrode (4) formed ...
|The invention provides a semiconductor device that solves a problem of |
reflection of a pattern of a wiring (9) formed on a back surface of a ...
|A peak detecting section (121) detects a maximal value (peak) in the frequency |
distribution every unit time from a wavelet intensity signal ...
|The invention provides a package type semiconductor device and a method of |
manufacturing the same where reliability and yield are ...
|A manufacturing method of a semiconductor device of this invention includes |
providing a semiconductor wafer (101) having a metal pad (102) ...
|This invention provides a semiconductor device that solves a problem that a |
pattern of a wiring formed on a back surface of a semiconductor ...
|A DC-DC converter comprising a regeneration preventive circuit (2) for turning off |
a synchronous rectification switch element ...